HFI 5110
HFI 5110 is a high molecular weight, high-density polyethylene with broad molecular weight distribution and 1-hexene as a co-monomer, specially developed for producing thin films with excellent strength and rigidity.
HFI 5110
High Density Polyethylene
HFI 5110 is a high molecular weight, high-density polyethylene with broad molecular weight distribution and 1-hexene as a co-monomer, specially developed for producing thin films with excellent strength and rigidity. This product is suitable for manufacturing of high strength grocery sacks, shopping bags and high quality thin films for uni/multi-wall packaging. Films produced with this grade can be readil
General Information
| Status | Commercial: Active | |
| Application | Blown film extrusion- Uni/multi wall packaging- High quality thin films- Shopping bags High strength grocery s | |
| Form(s) | Pellet | |
| Attribute | High tear resistance
High melt stability |
High quality graphic printing |
| Additives | Antioxidant: Yes
Zinc Stearate: Yes |
Antiblock: No
Slip Agent: No |
| Typical Properties
Physical |
Typical Value 1 Unit Test Method |
||
| High Load Melt Flow Index (190oC/ 21.6 kg) | 10 | g/10 min | ISO 1133 |
| Density 2 | 0.951 | g/cm3 | ISO 1183 |
| Mechanical 3 | |||
| Tensile Modulus of Elasticity | 1050 | MPa | ISO 527-1,2 |
| Tensile Strength (MD) | 55 | MPa | ISO 527-1,3 |
| Tensile Strength (TD) | 55 | MPa | ISO 527-1,3 |
| Tensile Strain at Break (MD) | 580 | % | ISO 527-1,3 |
| Tensile Strain at Break (TD) | 620 | % | ISO 527-1,3 |
| Tensile Stress at Yield | 26 | MPa ISO 527-1,3 | |
| Tensile Strain at Yield | 10 | % | ISO 527-1,3 |
| Elmendorf Tear Strength (MD) | 250 | mN | ISO 6383-2 |
| Elmendorf Tear Strength (TD) | 800 | mN | ISO 6383-2 |
Thermal
| Melting Temperature | 132 | °C | ISO 3146 |
| Vicat Softening Temperature (Method A/10N) | 127 | °C | ISO 306 |
| Recommended Process Conditions 4 | |||
| Extruder temperature profile: 200-235 °C | Blow up ratio: 3-5 | ||
| Film thickness: 15-50 μm |
- Typical values: these are not to be construed as
- The density parameter was determined on compression-molded specimens, which were prepared in accordance with procedure C of ASTM D4703, Annex A1.
- Properties are based on 20 μm blown film produced at a melt temperature of 220°C and 3 BUR using 100% HFI5110 resin. Modulus property is based on compression-molded specimens, which were prepared in accordance with procedure B of ASTM D4703, Annex
- Please note that, these processing conditions are recommended by manufacturer only for 100% HFI5110 resin (not in the case of blending with any other compatible material), therefore because of the many particular factors which are outside our current knowledge and control and may affect the use of product, no warranty is given for the foregoing Moreover, the specific recommendations for resin type and processing conditions can only be made when the end use, required properties and fabrication equipment are known.
| MFI (dg/min): | 10 (190 °C/21.6 Kg) |
|---|---|
| Density (kg/m3): | 951 |
| Application(s): | Blown film extrusion- Uni/multi wall packaging- High quality thin films- Shopping bags High strength grocery s |
TDS : Download
MSDS: Download
